Corexis Memory
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| Items | Capacity |
|---|---|
| 1. Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. |
| 2. Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
| 3. Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| 4. PCB Max panel size | 1150mm × 560mm |
| 5. Layer | Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers |
| 6. Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| 7. PCBA QC | X-ray, AOI Test, Functional Test |
| 8. Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
| 9. Our service | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers. One stop services. |
| 10. Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. |
| 11. SMT Capacity | 700 Million Points/Day |
| 12. DIP Capacity | 0.5 Million Points/Day |
| 13. Certificate | RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485 |
