Explore our core product lines, ranging from high-capacity ECC server memory modules to precision multi-layer PCB designs, supporting advanced thermal control integrations.
A comprehensive hardware pioneer engineering next-gen hardware architectures, integrating thermal dynamics with world-class memory storage solutions.
Corexis Memory Technology Co., Ltd. is a professional DDR5 memory and custom thermal solutions manufacturer dedicated to delivering high-performance DRAM and heat dissipation systems for global OEM, ODM, and system integration customers. Since our establishment in 2016, we have focused on memory technology innovation, structural cooling dynamics, advanced SMT manufacturing, and strict quality control pipelines.
Our solutions are deployed globally, providing reliable foundation layers for high-TDP server setups, AI supercomputing environments, cloud datacenters, and heavy industrial computing applications. Operating a state-of-the-art facility spanning 21,800 m², we optimize every product lifecycle phase from hardware formulation and signal integrity simulation to heat-sink thermal mapping and custom packaging.
Our collaborative hardware optimization strategy bridges the gap between memory storage performance and thermal protection. By optimizing PCB layouts and structural heat spreaders together, Corexis mitigates critical heat thresholds, preventing system throttling and securing operational longevity.
Analyzing the transitions in thermal architecture from standard air cooling to advanced liquid-to-chip interfaces to match rising processor TDPs.
Standard copper blocks fail as thermal design power (TDP) exceeds 350W. Our custom 3D Vapor Chambers (3D VC) link internal vapor routes with direct-contact copper pipes, spreading thermal loads evenly. This design lowers thermal resistance by up to 25% compared to solid copper blocks, maintaining stable junction temperatures during high processing spikes.
By using automated precision stamping, we manufacture zipper fins with thicknesses down to 0.2mm and pitch tolerances within 0.05mm. This design optimizes the airflow channel, balancing maximum heat dissipation area with minimal static pressure drop. It allows servers to run efficiently without requiring high-RPM, high-power cooling fans.
For high-density AI clusters exceeding 700W per GPU/CPU node, we offer micro-channel direct-to-chip (D2C) liquid cold plates. Made of oxygen-free copper and vacuum-brazed for safety, these cold plates support long-term operation under high pressure. They integrate seamlessly with standard water-glycol coolant mixtures.
A primary failure point in enterprise server hardware is uneven thermal expansion between the PCB substrate and the attached radiator block. At Corexis, our engineering teams bridge this gap by designing thermal solutions alongside the PCB assembly. We carefully select thermal interface materials (TIM) and spring-loaded screw tensions to match the mechanical specifications of the PCB. This prevents board warping, solder joint cracks under heat strain, and signal degradation in critical DDR5 or PCIe lanes.
Direct insights into our automated production lines, showcasing advanced SMT systems and vertical manufacturing that secure quick turnaround times and stable quality.
Our factory utilizes high-accuracy SMT lines capable of placing components down to 0201 size with high repeatability. By pairing advanced chip placement technology with vacuum reflow ovens, we maintain low void rates in solder connections. This setup enables us to produce stable memory PCBs, gold detector circuits, and controller boards that interface directly with our custom server radiators.
By housing PCB fabrication, SMT assembly, manual insertion, and thermal radiator manufacturing under one roof, we eliminate intermediate shipping delays and reduce assembly error risks. Having all stages at a single site helps secure component availability, control costs, and maintain stable production lead times for global projects.
Customized engineering configurations built to resolve thermal limitations across diverse, high-demand industrial application fields.
Standardized server racks require thin, efficient cooling layouts. We provide 1U and 2U copper-finned passive and active radiators designed for dense rack configurations. These systems help lower cooling energy costs and improve power usage effectiveness (PUE).
AI workloads require continuous high power. Our cooling designs use custom vapor chambers and thick thermal contact plates to cool multi-GPU setups. These help manage high thermal loads and reduce temperature variations across GPU cores.
Industrial computers often operate in dusty or harsh environments. Our dust-resistant fanless cooling blocks and thick copper heat-pipe assemblies run quietly and reliably without requiring filter changes, helping prevent system downtime.
Purchasing teams face ongoing challenges from volatile material costs, shifting trade policies, and long shipping times. Corexis helps address these risks through flexible contract pricing options, buffer stock agreements, and direct support from regional offices. We ensure all custom radiator designs and electronics assemblies comply with international safety regulations, simplifying the import process for global markets.
From incoming material inspection to out-of-box quality auditing, our testing protocols help secure long-term operational reliability.
Our quality department uses five distinct inspection phases to monitor manufacturing standards:
To verify long-term performance under load, we run key verification protocols in-house:
Get quick answers regarding thermal custom prototyping, production capacity, design alignment, and procurement logistics.
Explore additional memory modules, multi-layer PCBs, and industrial board options designed for high-density compute systems.
Corexis Memory
