Corexis Memory
High-reliability components engineered for critical applications in communication, industrial computing, and high-frequency power electronics.
The Philippines remains one of Southeast Asia's powerhouse manufacturing hubs, with electronics representing over 50% of the nation's export share. The integration of advanced SMT (Surface Mount Technology) assembly lines and precision multi-layer circuit board production within special economic zones—such as PEZA enclaves in Calabarzon and Clark—has elevated the region's stature from basic assembly to high-complexity microelectronics manufacturing. As demand spikes for global high-speed computing, the local industrial framework is expanding to support advanced substrates, including multi-layer printed circuit boards ranging from 4-layer up to 32-layer designs.
Our operation leverages this strategic regional benefit. With high-speed global shipping lines via Manila and Batangas ports, we ensure prompt customs clearances, tax incentives under economic zones, and a highly skilled engineering workforce certified under IPC and ISO quality frameworks. This structural advantage allows us to offer competitively priced, high-integrity multilayer PCBs and specialized high-speed memory modules designed for enterprise servers and complex telecommunications infrastructures.
Information Gain Indicator: In the current electronic product cycle, signal degradation at high frequencies (exceeding 2.4GHz) demands tight control over PCB dielectric properties. High-frequency boards produced in the region increasingly utilize high-Tg FR-4 material layers to avoid thermal delamination during reflow profiles exceeding 260°C.
Modern IoT devices, server arrays, and industrial automotive control units are shrinking in size while demanding exponentially higher computing capacities. Traditional double-sided PCBs can no longer handle the route density required for contemporary BGA (Ball Grid Array) component pitches. Consequently, the global supply chain has shifted toward high-density interconnect (HDI) technologies and multi-layer boards featuring blind and buried vias.
By routing power, ground, and signal channels across multiple internal layers, designers can actively minimize electromagnetic interference (EMI) and manage impedance parameters. Whether executing custom board configurations for prototype industrial welding control inverters or configuring complex DDR4/DDR5 system interfaces, multi-layer technology remains key to structural system stability.
Corexis Memory Technology Co., Ltd. has established itself as an innovative force in high-density RAM module engineering and precision multi-layer substrate design. Founded in 2016, our primary operational mission spans high-speed SMT assembly, automated microelectronic board testing, and full-spectrum custom PCB solutions for global enterprise sectors. Although recognized extensively for high-performance DDR4 and DDR5 memory configurations, our fundamental technological competitive advantage rests in our core capability to design and process high-speed multi-layer FR4 structures under tight tolerances.
Equipped with a modern 21,800 m² factory, our team operates advanced pick-and-place lines, lead-free nitrogen reflow ovens, and comprehensive optical and X-ray inspection equipment. This robust manufacturing framework ensures that every memory board or prototype PCB we manufacture meets strict IPC Class II or III operational criteria.
Our quality management division is built on five pillars of continuous testing: Incoming Material Inspection (IQC), In-Process Quality Control (IPQC), Final Quality Control (FQC), Outgoing Quality Assurance (OQA), and comprehensive system-level compatibility tests. In high-frequency memory arrays, trace lengths must be balanced precisely to within fractions of a millimeter to prevent signal skewing. Our testing facilities employ high-frequency oscilloscopes and bit-error-rate testing jigs to guarantee that all manufactured DDR4 and DDR5 modules run reliably at speeds of up to 3200MHz and beyond under temperature stress ranges from 0°C to 85°C.
Custom-engineered DDR4 modules designed for industrial computers, workstation motherboards, and localized server frameworks.
For high-frequency multi-layer circuit boards, material selection is critical to ensuring robust electrical performance. Standard low-cost boards suffer from high dielectric losses at high gigahertz speeds. For this reason, we employ specialized sub-materials such as KB6160 FR-4, which offers a stable dielectric constant (Dk) and low dissipation factor (Df). When layered appropriately with copper foil, these materials prevent signal distortion and maintain structural integrity during thermal excursions.
The standard design flow of high-reliability multi-layer boards involves three primary structural parameters:
SEO Intent Alignment: Modern industrial buyers search specifically for custom board stackups that can withstand environments with high heat and high vibration. Our implementation of Kingboard (KB) laminates ensures structural stability under sustained mechanical stress.
In local industries, from smart agricultural networks in Davao to automatic factory floors in Santa Rosa, Laguna, multi-layer circuit boards serve as the foundation of modern infrastructure. For example, custom multi-layer circuit boards with integrated WiFi telemetry allow remote agricultural sensors to transmit environmental metrics directly to cloud systems. Similarly, automated welding machines and high-frequency power inverters utilize multilayer PCBs to manage high current outputs safely without burning trace lines.
By producing components that perform reliably in humid, high-temperature climates, we provide local assembly operations with the durable parts needed to keep systems running smoothly and prevent unplanned downtime.
Explore inside our manufacturing plant: 21,800 square meters of high-tech production machinery, SMT assembly, and strict testing protocols.
Industrial server memory, heat management solutions, and double-sided multi-layer components designed for sustained operations.
Operating as a global manufacturer and exporter requires more than simple technical capacity; it requires a highly resilient supply chain infrastructure. With over 1,120 partner suppliers globally, we maintain a secure, continuous flow of high-quality components and substrates, mitigating the risk of material shortages. This strategic advantage ensures that our OEM and ODM clients receive their bulk orders on schedule, without costly delays.
From custom trace configurations to custom heat spreaders and packaging solutions, our engineering team works closely with systems integrators and industrial distributors. By providing comprehensive design-for-manufacturing (DFM) feedback early in the process, we help optimize manufacturing efficiency, reduce assembly costs, and ensure consistent quality from prototype through full-scale production runs.
Get answers to common questions about our PCB manufacturing processes, quality certifications, and ordering options.
We primarily utilize high-grade laminates such as Kingboard KB6160 FR-4, as well as specialized high-Tg (Glass Transition Temperature) and halogen-free substrates. These materials are selected to guarantee dimensional stability and excellent electrical performance during high-temperature reflow cycles.
Yes. We provide complete OEM/ODM customization services, including custom layer stackups, controlled impedance profiling, custom heat spreader designs, and conformal coating options. These coatings protect components against humidity and dust, which is particularly beneficial for industrial systems operating in tropical or challenging environments.
Every module undergoes 100% full testing. Our QA workflow includes Automated Optical Inspection (AOI), X-ray inspection for multi-layer trace alignment, and real-world system compatibility testing across a wide range of motherboard platforms. This ensures stable performance at speeds up to 3200MHz.
With 8 years of export experience, we manage all export customs clearances and logistics documentation. We ship via air freight and major sea ports, coordinating with economic zones like PEZA to ensure smooth delivery directly to your facility.
Prototype multi-layer board runs are typically completed within 5 to 7 working days. High-volume bulk production runs, including complete assembly and automated testing, generally take 15 to 25 days depending on the complexity of the design and component sourcing requirements.
Yes. All our production processes and materials comply with RoHS (Restriction of Hazardous Substances) and REACH regulations. We also offer halogen-free board configurations to meet strict environmental and corporate governance requirements.